Effects of interfacial residual stress on Tg of epoxy resin

Proceedings of the Electronic Technology Conference, EPTC

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Main Authors: Wang, Hongbing, Siow, Kok Siong
Other Authors: CHEMISTRY
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/77433
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-774332024-11-14T01:43:34Z Effects of interfacial residual stress on Tg of epoxy resin Wang, Hongbing Siow, Kok Siong CHEMISTRY Proceedings of the Electronic Technology Conference, EPTC 228-232 00313 2014-06-23T05:54:59Z 2014-06-23T05:54:59Z 1997 Conference Paper Wang, Hongbing,Siow, Kok Siong (1997). Effects of interfacial residual stress on Tg of epoxy resin. Proceedings of the Electronic Technology Conference, EPTC : 228-232. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/77433 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description Proceedings of the Electronic Technology Conference, EPTC
author2 CHEMISTRY
author_facet CHEMISTRY
Wang, Hongbing
Siow, Kok Siong
format Conference or Workshop Item
author Wang, Hongbing
Siow, Kok Siong
spellingShingle Wang, Hongbing
Siow, Kok Siong
Effects of interfacial residual stress on Tg of epoxy resin
author_sort Wang, Hongbing
title Effects of interfacial residual stress on Tg of epoxy resin
title_short Effects of interfacial residual stress on Tg of epoxy resin
title_full Effects of interfacial residual stress on Tg of epoxy resin
title_fullStr Effects of interfacial residual stress on Tg of epoxy resin
title_full_unstemmed Effects of interfacial residual stress on Tg of epoxy resin
title_sort effects of interfacial residual stress on tg of epoxy resin
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/77433
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