Effects of interfacial residual stress on Tg of epoxy resin
Proceedings of the Electronic Technology Conference, EPTC
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sg-nus-scholar.10635-774332024-11-14T01:43:34Z Effects of interfacial residual stress on Tg of epoxy resin Wang, Hongbing Siow, Kok Siong CHEMISTRY Proceedings of the Electronic Technology Conference, EPTC 228-232 00313 2014-06-23T05:54:59Z 2014-06-23T05:54:59Z 1997 Conference Paper Wang, Hongbing,Siow, Kok Siong (1997). Effects of interfacial residual stress on Tg of epoxy resin. Proceedings of the Electronic Technology Conference, EPTC : 228-232. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/77433 NOT_IN_WOS Scopus |
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Proceedings of the Electronic Technology Conference, EPTC |
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CHEMISTRY |
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CHEMISTRY Wang, Hongbing Siow, Kok Siong |
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Conference or Workshop Item |
author |
Wang, Hongbing Siow, Kok Siong |
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Wang, Hongbing Siow, Kok Siong Effects of interfacial residual stress on Tg of epoxy resin |
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Wang, Hongbing |
title |
Effects of interfacial residual stress on Tg of epoxy resin |
title_short |
Effects of interfacial residual stress on Tg of epoxy resin |
title_full |
Effects of interfacial residual stress on Tg of epoxy resin |
title_fullStr |
Effects of interfacial residual stress on Tg of epoxy resin |
title_full_unstemmed |
Effects of interfacial residual stress on Tg of epoxy resin |
title_sort |
effects of interfacial residual stress on tg of epoxy resin |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/77433 |
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