Effects of interfacial residual stress on Tg of epoxy resin
Proceedings of the Electronic Technology Conference, EPTC
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Main Authors: | Wang, Hongbing, Siow, Kok Siong |
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Other Authors: | CHEMISTRY |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/77433 |
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Institution: | National University of Singapore |
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