Effects of interfacial residual stress on Tg of epoxy resin

Proceedings of the Electronic Technology Conference, EPTC

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Bibliographic Details
Main Authors: Wang, Hongbing, Siow, Kok Siong
Other Authors: CHEMISTRY
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/77433
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Institution: National University of Singapore