High-performance CPW fillers use bond wires
Microwaves and RF
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Main Authors: | Sivanand, K., Uysal, S., Eccleston, K.W. |
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Other Authors: | ELECTRICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/80540 |
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Institution: | National University of Singapore |
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