High-performance CPW fillers use bond wires

Microwaves and RF

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Bibliographic Details
Main Authors: Sivanand, K., Uysal, S., Eccleston, K.W.
Other Authors: ELECTRICAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/80540
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Institution: National University of Singapore

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