Development of lead-free Sn-0.7Cu/Al2O3 nanocomposite solders with superior strength

10.1088/0022-3727/41/9/095403

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Bibliographic Details
Main Authors: Zhong, X.L., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/84991
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Institution: National University of Singapore
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