Development of lead-free Sn-0.7Cu/Al2O3 nanocomposite solders with superior strength
10.1088/0022-3727/41/9/095403
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Main Authors: | Zhong, X.L., Gupta, M. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/84991 |
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Institution: | National University of Singapore |
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