Interface thermal characteristics of flip chip packages - A numerical study

10.1016/j.applthermaleng.2008.04.002

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Bibliographic Details
Main Authors:	Kandasamy, R., Mujumdar, A.S.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Effect of voids Flip chip BGA Interface thermal resistance Numerical simulation Thermal interface Materials
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/85331
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-85331
record_format	dspace
spelling	sg-nus-scholar.10635-853312023-10-30T08:31:49Z Interface thermal characteristics of flip chip packages - A numerical study Kandasamy, R. Mujumdar, A.S. MECHANICAL ENGINEERING Effect of voids Flip chip BGA Interface thermal resistance Numerical simulation Thermal interface Materials 10.1016/j.applthermaleng.2008.04.002 Applied Thermal Engineering 29 5-6 822-829 ATENF 2014-10-07T09:06:46Z 2014-10-07T09:06:46Z 2009-04 Article Kandasamy, R., Mujumdar, A.S. (2009-04). Interface thermal characteristics of flip chip packages - A numerical study. Applied Thermal Engineering 29 (5-6) : 822-829. ScholarBank@NUS Repository. https://doi.org/10.1016/j.applthermaleng.2008.04.002 13594311 http://scholarbank.nus.edu.sg/handle/10635/85331 000263608900004 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Effect of voids Flip chip BGA Interface thermal resistance Numerical simulation Thermal interface Materials
spellingShingle	Effect of voids Flip chip BGA Interface thermal resistance Numerical simulation Thermal interface Materials Kandasamy, R. Mujumdar, A.S. Interface thermal characteristics of flip chip packages - A numerical study
description	10.1016/j.applthermaleng.2008.04.002
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Kandasamy, R. Mujumdar, A.S.
format	Article
author	Kandasamy, R. Mujumdar, A.S.
author_sort	Kandasamy, R.
title	Interface thermal characteristics of flip chip packages - A numerical study
title_short	Interface thermal characteristics of flip chip packages - A numerical study
title_full	Interface thermal characteristics of flip chip packages - A numerical study
title_fullStr	Interface thermal characteristics of flip chip packages - A numerical study
title_full_unstemmed	Interface thermal characteristics of flip chip packages - A numerical study
title_sort	interface thermal characteristics of flip chip packages - a numerical study
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/85331
_version_	1781784648309800960

Interface thermal characteristics of flip chip packages - A numerical study

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