Nanocrystalline grain size control for Ni80Fe20/Cu micro-composite wires by different electrodeposition methods
10.1016/j.jmatprotec.2007.04.019
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Main Authors: | Seet, H.L., Li, X.P., Lee, K.S., Chia, H.Y. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/85451 |
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Institution: | National University of Singapore |
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