A study on the mechanical behavior of the sputtered nickel thin Films for UBM applications

A study on the mechanical behavior of the sputtered nickel thin Films for UBM applications

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Bibliographic Details
Main Authors: Sekhar, V.N., Srinivasarao, V., Jayaganthan, R., Mohankumar, K., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85865
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Institution: National University of Singapore
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Summary:Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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