Application of modified virtual crack closure method on delamination analysis in a plastic IC package during lead-free solder reflow

Application of modified virtual crack closure method on delamination analysis in a plastic IC package during lead-free solder reflow

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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Bibliographic Details
Main Authors: Hu, G., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85883
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-858832024-11-13T13:23:20Z Application of modified virtual crack closure method on delamination analysis in a plastic IC package during lead-free solder reflow Hu, G. Tay, A.A.O. MECHANICAL ENGINEERING Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 2 555-560 2014-10-07T09:13:19Z 2014-10-07T09:13:19Z 2005 Conference Paper Hu, G.,Tay, A.A.O. (2005). Application of modified virtual crack closure method on delamination analysis in a plastic IC package during lead-free solder reflow. Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 2 : 555-560. ScholarBank@NUS Repository. 0780395786 http://scholarbank.nus.edu.sg/handle/10635/85883 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Hu, G.
Tay, A.A.O.
format Conference or Workshop Item
author Hu, G.
Tay, A.A.O.
spellingShingle Hu, G.
Tay, A.A.O.
Application of modified virtual crack closure method on delamination analysis in a plastic IC package during lead-free solder reflow
author_sort Hu, G.
title Application of modified virtual crack closure method on delamination analysis in a plastic IC package during lead-free solder reflow
title_short Application of modified virtual crack closure method on delamination analysis in a plastic IC package during lead-free solder reflow
title_full Application of modified virtual crack closure method on delamination analysis in a plastic IC package during lead-free solder reflow
title_fullStr Application of modified virtual crack closure method on delamination analysis in a plastic IC package during lead-free solder reflow
title_full_unstemmed Application of modified virtual crack closure method on delamination analysis in a plastic IC package during lead-free solder reflow
title_sort application of modified virtual crack closure method on delamination analysis in a plastic ic package during lead-free solder reflow
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/85883
_version_ 1821214175292030976

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