Dynamic materials testing and modeling of solder interconnects

Proceedings - Electronic Components and Technology Conference

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Bibliographic Details
Main Authors:	Ong, K.C., Tan, V.B.C., Lim, C.T., Wong, E.H., Zhang, X.W.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/85929
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-85929
record_format	dspace
spelling	sg-nus-scholar.10635-859292015-02-27T05:33:42Z Dynamic materials testing and modeling of solder interconnects Ong, K.C. Tan, V.B.C. Lim, C.T. Wong, E.H. Zhang, X.W. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 1 1075-1079 PECCA 2014-10-07T09:13:50Z 2014-10-07T09:13:50Z 2004 Conference Paper Ong, K.C.,Tan, V.B.C.,Lim, C.T.,Wong, E.H.,Zhang, X.W. (2004). Dynamic materials testing and modeling of solder interconnects. Proceedings - Electronic Components and Technology Conference 1 : 1075-1079. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/85929 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Proceedings - Electronic Components and Technology Conference
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Ong, K.C. Tan, V.B.C. Lim, C.T. Wong, E.H. Zhang, X.W.
format	Conference or Workshop Item
author	Ong, K.C. Tan, V.B.C. Lim, C.T. Wong, E.H. Zhang, X.W.
spellingShingle	Ong, K.C. Tan, V.B.C. Lim, C.T. Wong, E.H. Zhang, X.W. Dynamic materials testing and modeling of solder interconnects
author_sort	Ong, K.C.
title	Dynamic materials testing and modeling of solder interconnects
title_short	Dynamic materials testing and modeling of solder interconnects
title_full	Dynamic materials testing and modeling of solder interconnects
title_fullStr	Dynamic materials testing and modeling of solder interconnects
title_full_unstemmed	Dynamic materials testing and modeling of solder interconnects
title_sort	dynamic materials testing and modeling of solder interconnects
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/85929
_version_	1681089890553430016

Dynamic materials testing and modeling of solder interconnects

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