Dynamic materials testing and modeling of solder interconnects

• Main Authors: Ong, K.C., Tan, V.B.C., Lim, C.T., Wong, E.H., Zhang, X.W.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/85929
• Institution: National University of Singapore

Proceedings - Electronic Components and Technology Conference