Improved slim sector model for analysis of solder joint reliability

Improved slim sector model for analysis of solder joint reliability

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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Bibliographic Details
Main Authors: Zhao, B., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85989
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Institution: National University of Singapore
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Summary:Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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