Improved slim sector model for analysis of solder joint reliability
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
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2014
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sg-nus-scholar.10635-859892015-02-12T23:50:34Z Improved slim sector model for analysis of solder joint reliability Zhao, B. Tay, A.A.O. MECHANICAL ENGINEERING Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 2 431-438 2014-10-07T09:14:34Z 2014-10-07T09:14:34Z 2005 Conference Paper Zhao, B.,Tay, A.A.O. (2005). Improved slim sector model for analysis of solder joint reliability. Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 2 : 431-438. ScholarBank@NUS Repository. 0780395786 http://scholarbank.nus.edu.sg/handle/10635/85989 NOT_IN_WOS Scopus |
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Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Zhao, B. Tay, A.A.O. |
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Conference or Workshop Item |
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Zhao, B. Tay, A.A.O. |
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Zhao, B. Tay, A.A.O. Improved slim sector model for analysis of solder joint reliability |
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Zhao, B. |
title |
Improved slim sector model for analysis of solder joint reliability |
title_short |
Improved slim sector model for analysis of solder joint reliability |
title_full |
Improved slim sector model for analysis of solder joint reliability |
title_fullStr |
Improved slim sector model for analysis of solder joint reliability |
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Improved slim sector model for analysis of solder joint reliability |
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improved slim sector model for analysis of solder joint reliability |
publishDate |
2014 |
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http://scholarbank.nus.edu.sg/handle/10635/85989 |
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