Improved slim sector model for analysis of solder joint reliability

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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Bibliographic Details
Main Authors: Zhao, B., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85989
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-859892015-02-12T23:50:34Z Improved slim sector model for analysis of solder joint reliability Zhao, B. Tay, A.A.O. MECHANICAL ENGINEERING Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 2 431-438 2014-10-07T09:14:34Z 2014-10-07T09:14:34Z 2005 Conference Paper Zhao, B.,Tay, A.A.O. (2005). Improved slim sector model for analysis of solder joint reliability. Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 2 : 431-438. ScholarBank@NUS Repository. 0780395786 http://scholarbank.nus.edu.sg/handle/10635/85989 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Zhao, B.
Tay, A.A.O.
format Conference or Workshop Item
author Zhao, B.
Tay, A.A.O.
spellingShingle Zhao, B.
Tay, A.A.O.
Improved slim sector model for analysis of solder joint reliability
author_sort Zhao, B.
title Improved slim sector model for analysis of solder joint reliability
title_short Improved slim sector model for analysis of solder joint reliability
title_full Improved slim sector model for analysis of solder joint reliability
title_fullStr Improved slim sector model for analysis of solder joint reliability
title_full_unstemmed Improved slim sector model for analysis of solder joint reliability
title_sort improved slim sector model for analysis of solder joint reliability
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/85989
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