Rate-dependent properties of Sn-Ag-Cu based lead free solder joints
10.1109/EPTC.2009.5416537
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2014
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sg-nus-scholar.10635-860672023-10-31T20:14:20Z Rate-dependent properties of Sn-Ag-Cu based lead free solder joints Su, Y. Tan, L.B. Tan, V.B.C. Tee, T.Y. MECHANICAL ENGINEERING 10.1109/EPTC.2009.5416537 Proceedings of the Electronic Packaging Technology Conference, EPTC 283-291 2014-10-07T09:15:29Z 2014-10-07T09:15:29Z 2009 Conference Paper Su, Y., Tan, L.B., Tan, V.B.C., Tee, T.Y. (2009). Rate-dependent properties of Sn-Ag-Cu based lead free solder joints. Proceedings of the Electronic Packaging Technology Conference, EPTC : 283-291. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2009.5416537 9781424451005 http://scholarbank.nus.edu.sg/handle/10635/86067 000288404200048 Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
10.1109/EPTC.2009.5416537 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Su, Y. Tan, L.B. Tan, V.B.C. Tee, T.Y. |
| format |
Conference or Workshop Item |
| author |
Su, Y. Tan, L.B. Tan, V.B.C. Tee, T.Y. |
| spellingShingle |
Su, Y. Tan, L.B. Tan, V.B.C. Tee, T.Y. Rate-dependent properties of Sn-Ag-Cu based lead free solder joints |
| author_sort |
Su, Y. |
| title |
Rate-dependent properties of Sn-Ag-Cu based lead free solder joints |
| title_short |
Rate-dependent properties of Sn-Ag-Cu based lead free solder joints |
| title_full |
Rate-dependent properties of Sn-Ag-Cu based lead free solder joints |
| title_fullStr |
Rate-dependent properties of Sn-Ag-Cu based lead free solder joints |
| title_full_unstemmed |
Rate-dependent properties of Sn-Ag-Cu based lead free solder joints |
| title_sort |
rate-dependent properties of sn-ag-cu based lead free solder joints |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/86067 |
| _version_ |
1781784800936329216 |