Rate-dependent properties of Sn-Ag-Cu based lead free solder joints
10.1109/EPTC.2009.5416537
Saved in:
Main Authors: | , , , |
---|---|
Other Authors: | |
Format: | Conference or Workshop Item |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/86067 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
id |
sg-nus-scholar.10635-86067 |
---|---|
record_format |
dspace |
spelling |
sg-nus-scholar.10635-860672023-10-31T20:14:20Z Rate-dependent properties of Sn-Ag-Cu based lead free solder joints Su, Y. Tan, L.B. Tan, V.B.C. Tee, T.Y. MECHANICAL ENGINEERING 10.1109/EPTC.2009.5416537 Proceedings of the Electronic Packaging Technology Conference, EPTC 283-291 2014-10-07T09:15:29Z 2014-10-07T09:15:29Z 2009 Conference Paper Su, Y., Tan, L.B., Tan, V.B.C., Tee, T.Y. (2009). Rate-dependent properties of Sn-Ag-Cu based lead free solder joints. Proceedings of the Electronic Packaging Technology Conference, EPTC : 283-291. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2009.5416537 9781424451005 http://scholarbank.nus.edu.sg/handle/10635/86067 000288404200048 Scopus |
institution |
National University of Singapore |
building |
NUS Library |
continent |
Asia |
country |
Singapore Singapore |
content_provider |
NUS Library |
collection |
ScholarBank@NUS |
description |
10.1109/EPTC.2009.5416537 |
author2 |
MECHANICAL ENGINEERING |
author_facet |
MECHANICAL ENGINEERING Su, Y. Tan, L.B. Tan, V.B.C. Tee, T.Y. |
format |
Conference or Workshop Item |
author |
Su, Y. Tan, L.B. Tan, V.B.C. Tee, T.Y. |
spellingShingle |
Su, Y. Tan, L.B. Tan, V.B.C. Tee, T.Y. Rate-dependent properties of Sn-Ag-Cu based lead free solder joints |
author_sort |
Su, Y. |
title |
Rate-dependent properties of Sn-Ag-Cu based lead free solder joints |
title_short |
Rate-dependent properties of Sn-Ag-Cu based lead free solder joints |
title_full |
Rate-dependent properties of Sn-Ag-Cu based lead free solder joints |
title_fullStr |
Rate-dependent properties of Sn-Ag-Cu based lead free solder joints |
title_full_unstemmed |
Rate-dependent properties of Sn-Ag-Cu based lead free solder joints |
title_sort |
rate-dependent properties of sn-ag-cu based lead free solder joints |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/86067 |
_version_ |
1781784800936329216 |