Rate-dependent properties of Sn-Ag-Cu based lead free solder joints

• Main Authors: Su, Y., Tan, L.B., Tan, V.B.C., Tee, T.Y.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/86067
• Institution: National University of Singapore

10.1109/EPTC.2009.5416537