Understanding and testing for drop impact failure

• Main Authors: Seah, S.K.W., Wong, E.H., Ranjan, R., Lim, C.T., Mai, Y.-W.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/86105
• Institution: National University of Singapore

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005