Understanding and testing for drop impact failure
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
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Main Authors: | Seah, S.K.W., Wong, E.H., Ranjan, R., Lim, C.T., Mai, Y.-W. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/86105 |
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Institution: | National University of Singapore |
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