Modeling adhesive failure in electronic packages

10.1109/EPTC.2006.342812

Saved in:

Bibliographic Details
Main Authors:	Chew, H.B., Guo, T.F., Cheng, L.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/86931
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-86931
record_format	dspace
spelling	sg-nus-scholar.10635-869312024-11-11T04:52:13Z Modeling adhesive failure in electronic packages Chew, H.B. Guo, T.F. Cheng, L. MECHANICAL ENGINEERING MATERIALS SCIENCE AND ENGINEERING 10.1109/EPTC.2006.342812 Proceedings of the Electronic Packaging Technology Conference, EPTC 787-792 2014-10-07T09:56:29Z 2014-10-07T09:56:29Z 2006 Conference Paper Chew, H.B.,Guo, T.F.,Cheng, L. (2006). Modeling adhesive failure in electronic packages. Proceedings of the Electronic Packaging Technology Conference, EPTC : 787-792. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EPTC.2006.342812" target="_blank">https://doi.org/10.1109/EPTC.2006.342812</a> 142440665X http://scholarbank.nus.edu.sg/handle/10635/86931 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1109/EPTC.2006.342812
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Chew, H.B. Guo, T.F. Cheng, L.
format	Conference or Workshop Item
author	Chew, H.B. Guo, T.F. Cheng, L.
spellingShingle	Chew, H.B. Guo, T.F. Cheng, L. Modeling adhesive failure in electronic packages
author_sort	Chew, H.B.
title	Modeling adhesive failure in electronic packages
title_short	Modeling adhesive failure in electronic packages
title_full	Modeling adhesive failure in electronic packages
title_fullStr	Modeling adhesive failure in electronic packages
title_full_unstemmed	Modeling adhesive failure in electronic packages
title_sort	modeling adhesive failure in electronic packages
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/86931
_version_	1821232718861565952

Modeling adhesive failure in electronic packages

Similar Items