Corrosion Mechanisms and Products of Copper in Aqueous Solutions at Various pH Values

Corrosion Mechanisms and Products of Copper in Aqueous Solutions at Various pH Values

Corrosion

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Bibliographic Details
Main Authors: Feng, Y., Siow, K.-S., Teo, W.-K., Tan, K.-L., Hsieh, A.-K.
Other Authors: PHYSICS
Format: Article
Published: 2014
Subjects:
Anodic dissolution
Aqueous solutions
Copper
Corrosion behavior
Corrosion resistance
Diffusion
Morphology
Ph
Scanning electron microscopy
Tap water
X-ray photoelectron spectroscopy
Online Access:http://scholarbank.nus.edu.sg/handle/10635/91428
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/91428

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