Corrosion Mechanisms and Products of Copper in Aqueous Solutions at Various pH Values

Corrosion

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Bibliographic Details
Main Authors:	Feng, Y., Siow, K.-S., Teo, W.-K., Tan, K.-L., Hsieh, A.-K.
Other Authors:	CHEMICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Anodic dissolution Aqueous solutions Copper Corrosion behavior Corrosion resistance Diffusion Morphology Ph Scanning electron microscopy Tap water X-ray photoelectron spectroscopy
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/91428
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-91428
record_format	dspace
spelling	sg-nus-scholar.10635-914282024-11-11T14:57:06Z Corrosion Mechanisms and Products of Copper in Aqueous Solutions at Various pH Values Feng, Y. Siow, K.-S. Teo, W.-K. Tan, K.-L. Hsieh, A.-K. CHEMICAL ENGINEERING PHYSICS Anodic dissolution Aqueous solutions Copper Corrosion behavior Corrosion resistance Diffusion Morphology Ph Scanning electron microscopy Tap water X-ray photoelectron spectroscopy Corrosion 53 5 389-398 CORRA 2014-10-09T08:17:59Z 2014-10-09T08:17:59Z 1997 Article Feng, Y.,Siow, K.-S.,Teo, W.-K.,Tan, K.-L.,Hsieh, A.-K. (1997). Corrosion Mechanisms and Products of Copper in Aqueous Solutions at Various pH Values. Corrosion 53 (5) : 389-398. ScholarBank@NUS Repository. 00109312 http://scholarbank.nus.edu.sg/handle/10635/91428 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Anodic dissolution Aqueous solutions Copper Corrosion behavior Corrosion resistance Diffusion Morphology Ph Scanning electron microscopy Tap water X-ray photoelectron spectroscopy
spellingShingle	Anodic dissolution Aqueous solutions Copper Corrosion behavior Corrosion resistance Diffusion Morphology Ph Scanning electron microscopy Tap water X-ray photoelectron spectroscopy Feng, Y. Siow, K.-S. Teo, W.-K. Tan, K.-L. Hsieh, A.-K. Corrosion Mechanisms and Products of Copper in Aqueous Solutions at Various pH Values
description	Corrosion
author2	CHEMICAL ENGINEERING
author_facet	CHEMICAL ENGINEERING Feng, Y. Siow, K.-S. Teo, W.-K. Tan, K.-L. Hsieh, A.-K.
format	Article
author	Feng, Y. Siow, K.-S. Teo, W.-K. Tan, K.-L. Hsieh, A.-K.
author_sort	Feng, Y.
title	Corrosion Mechanisms and Products of Copper in Aqueous Solutions at Various pH Values
title_short	Corrosion Mechanisms and Products of Copper in Aqueous Solutions at Various pH Values
title_full	Corrosion Mechanisms and Products of Copper in Aqueous Solutions at Various pH Values
title_fullStr	Corrosion Mechanisms and Products of Copper in Aqueous Solutions at Various pH Values
title_full_unstemmed	Corrosion Mechanisms and Products of Copper in Aqueous Solutions at Various pH Values
title_sort	corrosion mechanisms and products of copper in aqueous solutions at various ph values
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/91428
_version_	1821198342599737344

Corrosion Mechanisms and Products of Copper in Aqueous Solutions at Various pH Values

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