Corrosion Mechanisms and Products of Copper in Aqueous Solutions at Various pH Values

• Main Authors: Feng, Y., Siow, K.-S., Teo, W.-K., Tan, K.-L., Hsieh, A.-K.
• Other Authors: PHYSICS
• Format: Article
• Published: 2014
• Subjects: Anodic dissolution; Aqueous solutions; Copper; Corrosion behavior; Corrosion resistance; Diffusion; Morphology; Ph; Scanning electron microscopy; Tap water; X-ray photoelectron spectroscopy
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/91428
• Institution: National University of Singapore

Corrosion