Electroless plating of copper on poly(tetrafluoroethylene) films modified by NH3 plasma and surface graft copolymerization with aniline
10.1116/1.1388620
Saved in:
Main Authors: | Ma, Z.H., Tan, K.L., Alian, A.D., Kang, E.T., Neoh, K.G. |
---|---|
Other Authors: | CHEMICAL & ENVIRONMENTAL ENGINEERING |
Format: | Article |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/91963 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Electroless deposition of copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization and silanization
by: Wu, S., et al.
Published: (2014) -
Electroless plating of copper on poly(tetrafluoroethylene) films modified by surface graft copolymerization and quaternization
by: Yu, Z.J., et al.
Published: (2014) -
Consecutive graft copolymerization of glycidyl methacrylate and aniline on poly(tetrafluoroethylene) films
by: Zhang, M.C., et al.
Published: (2014) -
Surface modification of poly(tetrafluoroethylene) films by graft copolymerization for adhesion enhancement with electrolessly deposited copper
by: Wu, S., et al.
Published: (2014) -
Electroless deposition of copper and nickel on poly(tetrafluoroethylene) films modified by single and double surface graft copolymerization
by: Yang, G.H., et al.
Published: (2014)