Thermal and electroless deposition of copper on poly(tetrafluoroet hylene-co-hexafluoropropylene) films modified by surface graft copolymerization

Thermal and electroless deposition of copper on poly(tetrafluoroet hylene-co-hexafluoropropylene) films modified by surface graft copolymerization

10.1109/TADVP.2002.805316

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Bibliographic Details
Main Authors: Yang, G.H., Kang, E.T., Neoh, K.G.
Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Adhesion strength
Electroless plating
Evaporated copper
FEP
Surface grafting
Online Access:http://scholarbank.nus.edu.sg/handle/10635/92497
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Institution: National University of Singapore
Description
Summary:10.1109/TADVP.2002.805316

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