Thermal and electroless deposition of copper on poly(tetrafluoroet hylene-co-hexafluoropropylene) films modified by surface graft copolymerization

Thermal and electroless deposition of copper on poly(tetrafluoroet hylene-co-hexafluoropropylene) films modified by surface graft copolymerization

10.1109/TADVP.2002.805316

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Bibliographic Details
Main Authors: Yang, G.H., Kang, E.T., Neoh, K.G.
Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Adhesion strength
Electroless plating
Evaporated copper
FEP
Surface grafting
Online Access:http://scholarbank.nus.edu.sg/handle/10635/92497
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-924972023-10-26T07:31:32Z Thermal and electroless deposition of copper on poly(tetrafluoroet hylene-co-hexafluoropropylene) films modified by surface graft copolymerization Yang, G.H. Kang, E.T. Neoh, K.G. CHEMICAL & ENVIRONMENTAL ENGINEERING Adhesion strength Electroless plating Evaporated copper FEP Surface grafting 10.1109/TADVP.2002.805316 IEEE Transactions on Advanced Packaging 25 3 365-373 ITAPF 2014-10-09T10:04:19Z 2014-10-09T10:04:19Z 2002-08 Conference Paper Yang, G.H., Kang, E.T., Neoh, K.G. (2002-08). Thermal and electroless deposition of copper on poly(tetrafluoroet hylene-co-hexafluoropropylene) films modified by surface graft copolymerization. IEEE Transactions on Advanced Packaging 25 (3) : 365-373. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2002.805316 15213323 http://scholarbank.nus.edu.sg/handle/10635/92497 000180497000007 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Adhesion strength
Electroless plating
Evaporated copper
FEP
Surface grafting
spellingShingle Adhesion strength
Electroless plating
Evaporated copper
FEP
Surface grafting
Yang, G.H.
Kang, E.T.
Neoh, K.G.
Thermal and electroless deposition of copper on poly(tetrafluoroet hylene-co-hexafluoropropylene) films modified by surface graft copolymerization
description 10.1109/TADVP.2002.805316
author2 CHEMICAL & ENVIRONMENTAL ENGINEERING
author_facet CHEMICAL & ENVIRONMENTAL ENGINEERING
Yang, G.H.
Kang, E.T.
Neoh, K.G.
format Conference or Workshop Item
author Yang, G.H.
Kang, E.T.
Neoh, K.G.
author_sort Yang, G.H.
title Thermal and electroless deposition of copper on poly(tetrafluoroet hylene-co-hexafluoropropylene) films modified by surface graft copolymerization
title_short Thermal and electroless deposition of copper on poly(tetrafluoroet hylene-co-hexafluoropropylene) films modified by surface graft copolymerization
title_full Thermal and electroless deposition of copper on poly(tetrafluoroet hylene-co-hexafluoropropylene) films modified by surface graft copolymerization
title_fullStr Thermal and electroless deposition of copper on poly(tetrafluoroet hylene-co-hexafluoropropylene) films modified by surface graft copolymerization
title_full_unstemmed Thermal and electroless deposition of copper on poly(tetrafluoroet hylene-co-hexafluoropropylene) films modified by surface graft copolymerization
title_sort thermal and electroless deposition of copper on poly(tetrafluoroet hylene-co-hexafluoropropylene) films modified by surface graft copolymerization
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/92497
_version_ 1781785795838869504

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