Enhanced cooling of IC chip arrays on printed circuit boards
Proceedings of the Electronic Packaging Technology Conference, EPTC
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Main Authors: | Low, K.W., Yap, C. |
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Other Authors: | MECHANICAL & PRODUCTION ENGINEERING |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/92696 |
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Institution: | National University of Singapore |
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