Predicting delamination in plastic IC packages and determining suitable mold compound properties

10.1109/96.330428

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Bibliographic Details
Main Authors:	Tay, A.A.O., Tan, G.L., Lim, T.B.
Other Authors:	INSTITUTE OF MICROELECTRONICS
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/92771
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-927712023-10-30T21:38:57Z Predicting delamination in plastic IC packages and determining suitable mold compound properties Tay, A.A.O. Tan, G.L. Lim, T.B. INSTITUTE OF MICROELECTRONICS MECHANICAL & PRODUCTION ENGINEERING 10.1109/96.330428 IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging 17 2 201-208 IMTBE 2014-10-16T03:08:19Z 2014-10-16T03:08:19Z 1994-05 Article Tay, A.A.O., Tan, G.L., Lim, T.B. (1994-05). Predicting delamination in plastic IC packages and determining suitable mold compound properties. IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging 17 (2) : 201-208. ScholarBank@NUS Repository. https://doi.org/10.1109/96.330428 10709894 http://scholarbank.nus.edu.sg/handle/10635/92771 A1994NZ22000012 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1109/96.330428
author2	INSTITUTE OF MICROELECTRONICS
author_facet	INSTITUTE OF MICROELECTRONICS Tay, A.A.O. Tan, G.L. Lim, T.B.
format	Article
author	Tay, A.A.O. Tan, G.L. Lim, T.B.
spellingShingle	Tay, A.A.O. Tan, G.L. Lim, T.B. Predicting delamination in plastic IC packages and determining suitable mold compound properties
author_sort	Tay, A.A.O.
title	Predicting delamination in plastic IC packages and determining suitable mold compound properties
title_short	Predicting delamination in plastic IC packages and determining suitable mold compound properties
title_full	Predicting delamination in plastic IC packages and determining suitable mold compound properties
title_fullStr	Predicting delamination in plastic IC packages and determining suitable mold compound properties
title_full_unstemmed	Predicting delamination in plastic IC packages and determining suitable mold compound properties
title_sort	predicting delamination in plastic ic packages and determining suitable mold compound properties
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/92771
_version_	1781785816287150080

Predicting delamination in plastic IC packages and determining suitable mold compound properties

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