Thermal cure study of a low-k methyl silsesquioxane for intermetal dielectric application by FT-IR spectroscopy

Applied Spectroscopy

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Main Authors: Wang, C.Y., Shen, Z.X., Zheng, J.Z.
Other Authors: PHYSICS
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/98354
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-983542015-02-20T07:30:51Z Thermal cure study of a low-k methyl silsesquioxane for intermetal dielectric application by FT-IR spectroscopy Wang, C.Y. Shen, Z.X. Zheng, J.Z. PHYSICS Applied Spectroscopy 54 2 209-213 APSPA 2014-10-16T09:46:06Z 2014-10-16T09:46:06Z 2000-02 Article Wang, C.Y.,Shen, Z.X.,Zheng, J.Z. (2000-02). Thermal cure study of a low-k methyl silsesquioxane for intermetal dielectric application by FT-IR spectroscopy. Applied Spectroscopy 54 (2) : 209-213. ScholarBank@NUS Repository. 00037028 http://scholarbank.nus.edu.sg/handle/10635/98354 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Applied Spectroscopy
author2 PHYSICS
author_facet PHYSICS
Wang, C.Y.
Shen, Z.X.
Zheng, J.Z.
format Article
author Wang, C.Y.
Shen, Z.X.
Zheng, J.Z.
spellingShingle Wang, C.Y.
Shen, Z.X.
Zheng, J.Z.
Thermal cure study of a low-k methyl silsesquioxane for intermetal dielectric application by FT-IR spectroscopy
author_sort Wang, C.Y.
title Thermal cure study of a low-k methyl silsesquioxane for intermetal dielectric application by FT-IR spectroscopy
title_short Thermal cure study of a low-k methyl silsesquioxane for intermetal dielectric application by FT-IR spectroscopy
title_full Thermal cure study of a low-k methyl silsesquioxane for intermetal dielectric application by FT-IR spectroscopy
title_fullStr Thermal cure study of a low-k methyl silsesquioxane for intermetal dielectric application by FT-IR spectroscopy
title_full_unstemmed Thermal cure study of a low-k methyl silsesquioxane for intermetal dielectric application by FT-IR spectroscopy
title_sort thermal cure study of a low-k methyl silsesquioxane for intermetal dielectric application by ft-ir spectroscopy
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/98354
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