Vertically Coupled Microring Laser Devices based on InP using BCB Wafer Bonding

In this paper, we present our approach on the realization of vertical coupling technology that has been verified for microlaser fabrication as well as for the realization of high Q resonators with 'loss-less' cavities based on InP. The concept is based on full wafer technology and provides...

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Main Authors: Hamacher, M., Heidrich, H., Troppenz, U., Syvridis, D., Alexandropoulos, D., Mikroulis, S., Kapsalis, A., TEE, Chyng Wen, Williams, K. A., Dragoi, V., Alexe, M., Cristea, D., Kusko, M.
Format: text
Language:English
Published: Institutional Knowledge at Singapore Management University 2007
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Online Access:https://ink.library.smu.edu.sg/lkcsb_research/3358
https://ink.library.smu.edu.sg/context/lkcsb_research/article/4357/viewcontent/Waferbonded_ActivePassive_Vertically_Coupled_Micro.pdf
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Institution: Singapore Management University
Language: English