Vertically Coupled Microring Laser Devices based on InP using BCB Wafer Bonding
In this paper, we present our approach on the realization of vertical coupling technology that has been verified for microlaser fabrication as well as for the realization of high Q resonators with 'loss-less' cavities based on InP. The concept is based on full wafer technology and provides...
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Main Authors: | Hamacher, M., Heidrich, H., Troppenz, U., Syvridis, D., Alexandropoulos, D., Mikroulis, S., Kapsalis, A., TEE, Chyng Wen, Williams, K. A., Dragoi, V., Alexe, M., Cristea, D., Kusko, M. |
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Format: | text |
Language: | English |
Published: |
Institutional Knowledge at Singapore Management University
2007
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Online Access: | https://ink.library.smu.edu.sg/lkcsb_research/3358 https://ink.library.smu.edu.sg/context/lkcsb_research/article/4357/viewcontent/Waferbonded_ActivePassive_Vertically_Coupled_Micro.pdf |
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Institution: | Singapore Management University |
Language: | English |
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