Message from the Chairs: TechDebt 2023

Message from the Chairs: TechDebt 2023

Welcome to the 6th ACM/IEEE International Conference on Technical Debt, TechDebt 2023, co-located with the International Conference on Software Engineering (ICSE) 2023, in the beautiful city of Melbourne, Australia. After several years of virtual and hybrid conferences, TechDebt 2023 marks the first...

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Bibliographic Details
Main Authors: TREUDE, Christoph, CAI, Yuanfang, XIA, Xin, CODABUX, Zadia, HATA, Hideaki, DEISSENBOECK, Florian, SPINOLA, Rodrigo
Format: text
Language:English
Published: Institutional Knowledge at Singapore Management University 2023
Subjects:
Software Engineering
Online Access:https://ink.library.smu.edu.sg/sis_research/8954
https://ink.library.smu.edu.sg/context/sis_research/article/9957/viewcontent/td.pdf
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Institution: Singapore Management University
Language: English
Description
Summary:Welcome to the 6th ACM/IEEE International Conference on Technical Debt, TechDebt 2023, co-located with the International Conference on Software Engineering (ICSE) 2023, in the beautiful city of Melbourne, Australia. After several years of virtual and hybrid conferences, TechDebt 2023 marks the first predominantly in-person edition of the conference series since the onset of the Covid-19 pandemic.

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