Message from the Chairs: TechDebt 2023

Welcome to the 6th ACM/IEEE International Conference on Technical Debt, TechDebt 2023, co-located with the International Conference on Software Engineering (ICSE) 2023, in the beautiful city of Melbourne, Australia. After several years of virtual and hybrid conferences, TechDebt 2023 marks the first...

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Bibliographic Details
Main Authors: TREUDE, Christoph, CAI, Yuanfang, XIA, Xin, CODABUX, Zadia, HATA, Hideaki, DEISSENBOECK, Florian, SPINOLA, Rodrigo
Format: text
Language:English
Published: Institutional Knowledge at Singapore Management University 2023
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Online Access:https://ink.library.smu.edu.sg/sis_research/8954
https://ink.library.smu.edu.sg/context/sis_research/article/9957/viewcontent/td.pdf
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Institution: Singapore Management University
Language: English
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