Message from the Chairs: TechDebt 2023

Message from the Chairs: TechDebt 2023

Welcome to the 6th ACM/IEEE International Conference on Technical Debt, TechDebt 2023, co-located with the International Conference on Software Engineering (ICSE) 2023, in the beautiful city of Melbourne, Australia. After several years of virtual and hybrid conferences, TechDebt 2023 marks the first...

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Main Authors: TREUDE, Christoph, CAI, Yuanfang, XIA, Xin, CODABUX, Zadia, HATA, Hideaki, DEISSENBOECK, Florian, SPINOLA, Rodrigo
Format: text
Language:English
Published: Institutional Knowledge at Singapore Management University 2023
Subjects:
Software Engineering
Online Access:https://ink.library.smu.edu.sg/sis_research/8954
https://ink.library.smu.edu.sg/context/sis_research/article/9957/viewcontent/td.pdf
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Institution: Singapore Management University
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spelling sg-smu-ink.sis_research-99572024-07-04T08:16:36Z Message from the Chairs: TechDebt 2023 TREUDE, Christoph CAI, Yuanfang XIA, Xin CODABUX, Zadia HATA, Hideaki DEISSENBOECK, Florian SPINOLA, Rodrigo Welcome to the 6th ACM/IEEE International Conference on Technical Debt, TechDebt 2023, co-located with the International Conference on Software Engineering (ICSE) 2023, in the beautiful city of Melbourne, Australia. After several years of virtual and hybrid conferences, TechDebt 2023 marks the first predominantly in-person edition of the conference series since the onset of the Covid-19 pandemic. 2023-05-01T07:00:00Z text application/pdf https://ink.library.smu.edu.sg/sis_research/8954 info:doi/10.1109/TechDebt59074.2023.00005 https://ink.library.smu.edu.sg/context/sis_research/article/9957/viewcontent/td.pdf http://creativecommons.org/licenses/by-nc-nd/4.0/ Research Collection School Of Computing and Information Systems eng Institutional Knowledge at Singapore Management University Software Engineering
institution Singapore Management University
building SMU Libraries
continent Asia
country Singapore
Singapore
content_provider SMU Libraries
collection InK@SMU
language English
topic Software Engineering
spellingShingle Software Engineering
TREUDE, Christoph
CAI, Yuanfang
XIA, Xin
CODABUX, Zadia
HATA, Hideaki
DEISSENBOECK, Florian
SPINOLA, Rodrigo
Message from the Chairs: TechDebt 2023
description Welcome to the 6th ACM/IEEE International Conference on Technical Debt, TechDebt 2023, co-located with the International Conference on Software Engineering (ICSE) 2023, in the beautiful city of Melbourne, Australia. After several years of virtual and hybrid conferences, TechDebt 2023 marks the first predominantly in-person edition of the conference series since the onset of the Covid-19 pandemic.
format text
author TREUDE, Christoph
CAI, Yuanfang
XIA, Xin
CODABUX, Zadia
HATA, Hideaki
DEISSENBOECK, Florian
SPINOLA, Rodrigo
author_facet TREUDE, Christoph
CAI, Yuanfang
XIA, Xin
CODABUX, Zadia
HATA, Hideaki
DEISSENBOECK, Florian
SPINOLA, Rodrigo
author_sort TREUDE, Christoph
title Message from the Chairs: TechDebt 2023
title_short Message from the Chairs: TechDebt 2023
title_full Message from the Chairs: TechDebt 2023
title_fullStr Message from the Chairs: TechDebt 2023
title_full_unstemmed Message from the Chairs: TechDebt 2023
title_sort message from the chairs: techdebt 2023
publisher Institutional Knowledge at Singapore Management University
publishDate 2023
url https://ink.library.smu.edu.sg/sis_research/8954
https://ink.library.smu.edu.sg/context/sis_research/article/9957/viewcontent/td.pdf
_version_ 1814047656970813440

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