Deposition of au, au-v and au-vox on si wafers by co-sputtering technique

• المؤلفون الرئيسيون: Narksitipan S., Bannuru T., Brown W.L., Vinci R.P., Thongtem S.
• التنسيق: مقال
• اللغة: English
• منشور في: 2014
• الوصول للمادة أونلاين: http://www.scopus.com/inward/record.url?eid=2-s2.0-68149152180&partnerID=40&md5=5156b586a7d514276222dd385734c377; http://cmuir.cmu.ac.th/handle/6653943832/5835

Au, Au-V and Au-VOx thin films were deposited on Si wafers by a co-sputtering technique. A fourpoint probe shows that the electrical resistivity of pure Au thin film on Si wafer without annealing is 7.2 m ·cm. The resistivities of thin films deposited on Si wafers, with or without annealing, tended...