Redeposition-free of silicon etching by CF<inf>4</inf> microwave plasma in a medium vacuum process regime
© 2020 This work presents a redeposition-free process to etch silicon by CF4 plasma in a modified microwave oven reactor operated in a medium vacuum process regime (25 to 1 × 10−3 Torr) that only uses a mechanical pump which is introduced at a lower cost compared to the ICP etching system. In order...
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| Main Authors: | , |
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| 格式: | 雜誌 |
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2020
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| 主題: | |
| 在線閱讀: | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85086068373&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/70373 |
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| 機構: | Chiang Mai University |