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Maung Latt, K.
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Maung Latt, K.
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Maung Latt, K.
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1
Formation of Cu diffusion channels in Ta layer of a Cu/Ta/SiO2/Si structure
by
Li, S.
,
Dong, Zhili
,
Maung
Latt
,
K
.
,
Park, H. S.
,
White, Timothy John
Published 2011
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2
Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2
by
Lee, Y.K.
,
Maung
Latt
,
K
.
,
Li, S.
,
Osipowicz, T.
,
Chiam, S.Y.
Published 2014
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3
Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2
by
Lee, Y.K.
,
Maung
Latt
,
K
.
,
Jaehyung, K.
,
Osipowicz, T.
,
Lee, K.
Published 2014
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4
Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2
by
Maung
Latt
,
K
.
,
Park, H.S.
,
Li, S.
,
Rong, L.
,
Osipowicz, T.
,
Zhu, W.G.
,
Lee, Y.K.
Published 2014
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