Formation of Cu diffusion channels in Ta layer of a Cu/Ta/SiO2/Si structure

由 Li, S., Dong, Zhili, Maung Latt, K., Park, H. S., White, Timothy John
出版 2011

Characterization of interfacial reactions between ionized metal plasma deposited Al-0.5 wt.% Cu and Ti on SiO2

由 Lee, Y.K., Maung Latt, K., Li, S., Osipowicz, T., Chiam, S.Y.
出版 2014

Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2

由 Lee, Y.K., Maung Latt, K., Jaehyung, K., Osipowicz, T., Lee, K.
出版 2014

Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2

由 Maung Latt, K., Park, H.S., Li, S., Rong, L., Osipowicz, T., Zhu, W.G., Lee, Y.K.
出版 2014