Nissen fundoplication in paediatric patients: 5-year retrospective review of one centre's experience

by Yang, L.Y., Loh, D.L., Aw, M.M., Quak, S.H., Prabhakaran, K.
Published 2016

Thermal stability of Cu/Ta/ultra low k porous polymer structures for multilevel interconnects

by Zhang, D.H., Yang, L.Y., Li, C.Y., Liu, R., Wee, A.T.S., Foo, P.D.
Published 2014

Comparative study of Ta and TaN(N) in the barrier/ultra low k structures for deep submicron integrated circuits

by Yang, L.Y., Zhang, D.H., Li, C.Y., Liu, R., Wee, A.T.S., Foo, P.D.
Published 2014

Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects

by Yang, L.Y., Zhang, D.H., Li, C.Y., Liu, R., Wee, A.T.S., Foo, P.D.
Published 2014

Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration

by Yang, L.Y., Zhang, D.H., Li, C.Y., Liu, R., Lu, P.W., Foo, P.D., Wee, A.T.S.
Published 2014

A common BIM deletion polymorphism mediates intrinsic resistance and inferior responses to tyrosine kinase inhibitors in cancer

by Ng, K.P., Hillmer, A.M., Chuah, C.T.H., Juan, W.C., Ko, T.K., Teo, A.S.M., Ariyaratne, P.N., Takahashi, N., Sawada, K., Fei, Y., Soh, S., Lee, W.H., Huang, J.W.J., Allen Jr., J.C., Woo, X.Y., Nagarajan, N., Kumar, V., Thalamuthu, A., Poh, W.T., Ang, A.L., Mya, H.T., How, G.F., Yang, L.Y., Koh, L.P., Chowbay, B., Chang, C.-T., Nadarajan, V.S., Chng, W.J., Than, H., Lim, L.C., Goh, Y.T., Zhang, S., Poh, D., Tan, P., Seet, J.-E., Ang, M.-K., Chau, N.-M., Ng, Q.-S., Tan, D.S.W., Soda, M., Isobe, K., Nöthen, M.M., Wong, T.Y., Shahab, A., Ruan, X., Cacheux-Rataboul, V., Sung, W.-K., Tan, E.H., Yatabe, Y., Mano, H., Soo, R.A., Chin, T.M., Lim, W.-T., Ruan, Y., Ong, S.T.
Published 2014