Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects

Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects

10.1016/j.tsf.2004.05.071

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Bibliographic Details
Main Authors: Yang, L.Y., Zhang, D.H., Li, C.Y., Liu, R., Wee, A.T.S., Foo, P.D.
Other Authors: INSTITUTE OF ENGINEERING SCIENCE
Format: Article
Published: 2014
Subjects:
Barrier layer
Cu metallization
Thermal stability
Ultra low-k
Online Access:http://scholarbank.nus.edu.sg/handle/10635/113072
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/113072

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