Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects

Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects

10.1016/j.tsf.2004.05.071

Saved in:
Bibliographic Details
Main Authors: Yang, L.Y., Zhang, D.H., Li, C.Y., Liu, R., Wee, A.T.S., Foo, P.D.
Other Authors: INSTITUTE OF ENGINEERING SCIENCE
Format: Article
Published: 2014
Subjects:
Barrier layer
Cu metallization
Thermal stability
Ultra low-k
Online Access:http://scholarbank.nus.edu.sg/handle/10635/113072
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Similar Items

Similar Items