Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects

10.1016/j.tsf.2004.05.071

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Bibliographic Details
Main Authors:	Yang, L.Y., Zhang, D.H., Li, C.Y., Liu, R., Wee, A.T.S., Foo, P.D.
Other Authors:	INSTITUTE OF ENGINEERING SCIENCE
Format:	Article
Published:	2014
Subjects:	Barrier layer Cu metallization Thermal stability Ultra low-k
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/113072
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-113072
record_format	dspace
spelling	sg-nus-scholar.10635-1130722024-11-12T21:17:35Z Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects Yang, L.Y. Zhang, D.H. Li, C.Y. Liu, R. Wee, A.T.S. Foo, P.D. INSTITUTE OF ENGINEERING SCIENCE PHYSICS Barrier layer Cu metallization Thermal stability Ultra low-k 10.1016/j.tsf.2004.05.071 Thin Solid Films 462-463 SPEC. ISS. 182-185 THSFA 2014-11-28T09:11:39Z 2014-11-28T09:11:39Z 2004-09 Article Yang, L.Y., Zhang, D.H., Li, C.Y., Liu, R., Wee, A.T.S., Foo, P.D. (2004-09). Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects. Thin Solid Films 462-463 (SPEC. ISS.) : 182-185. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2004.05.071 00406090 http://scholarbank.nus.edu.sg/handle/10635/113072 000223812800038 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Barrier layer Cu metallization Thermal stability Ultra low-k
spellingShingle	Barrier layer Cu metallization Thermal stability Ultra low-k Yang, L.Y. Zhang, D.H. Li, C.Y. Liu, R. Wee, A.T.S. Foo, P.D. Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects
description	10.1016/j.tsf.2004.05.071
author2	INSTITUTE OF ENGINEERING SCIENCE
author_facet	INSTITUTE OF ENGINEERING SCIENCE Yang, L.Y. Zhang, D.H. Li, C.Y. Liu, R. Wee, A.T.S. Foo, P.D.
format	Article
author	Yang, L.Y. Zhang, D.H. Li, C.Y. Liu, R. Wee, A.T.S. Foo, P.D.
author_sort	Yang, L.Y.
title	Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects
title_short	Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects
title_full	Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects
title_fullStr	Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects
title_full_unstemmed	Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects
title_sort	characterization of cu/ta/ultra low-k porous polymer structures for multilevel interconnects
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/113072
_version_	1821209427108167680

Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects

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