Technical barriers and development of Cu wirebonding in nanoelectronics device packaging

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Bibliographic Details
Main Authors:	C., L. Gan, E., K. Ng, B., L. Chan, Uda, Hashim, Prof. Dr., F., C. Classe
Other Authors:	clgan pgg@yahoo.com
Format:	Article
Language:	English
Published:	Hindawi Publishing Corporation 2013
Subjects:	Nanoelectronics Wirebonding Cu wire
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/26072
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Institution:	Universiti Malaysia Perlis
Language:	English

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