Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors

Point defects in semiconductors cause many considerable behaviours of these materials. This article introduces a procedure for modelling of point defects using a structural approach often referred to as a bond-valence method. This method minimalizes the computation cost and facilitates a contruction...

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Main Author: Hoang, Nam Nhat
Format: Article
Language:English
Published: H. : ĐHQGHN 2018
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Online Access:http://repository.vnu.edu.vn/handle/VNU_123/62915
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Institution: Vietnam National University, Hanoi
Language: English
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spelling oai:112.137.131.14:VNU_123-629152018-10-09T08:25:38Z Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors Hoang, Nam Nhat Bond-valence Defects Modelling Tools Point defects in semiconductors cause many considerable behaviours of these materials. This article introduces a procedure for modelling of point defects using a structural approach often referred to as a bond-valence method. This method minimalizes the computation cost and facilitates a contruction of complex 3D images illustrating the point defects, including the charge distribution map at contact interfaces. This method also provides a convenient way to estimate the carrier density and defect locations, it visualizes a dynamics of valence relocation under thermal fluctuation 2018-10-09T08:25:38Z 2018-10-09T08:25:38Z 2018 Article Hoang, N. N. (2018). Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors. VNU Journal of Science: Mathematics – Physics, Vol. 34, No. 3 (2018), 85-89 2588-1124 http://repository.vnu.edu.vn/handle/VNU_123/62915 en VNU Journal of Science; application/pdf H. : ĐHQGHN
institution Vietnam National University, Hanoi
building VNU Library & Information Center
country Vietnam
collection VNU Digital Repository
language English
topic Bond-valence
Defects
Modelling
Tools
spellingShingle Bond-valence
Defects
Modelling
Tools
Hoang, Nam Nhat
Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors
description Point defects in semiconductors cause many considerable behaviours of these materials. This article introduces a procedure for modelling of point defects using a structural approach often referred to as a bond-valence method. This method minimalizes the computation cost and facilitates a contruction of complex 3D images illustrating the point defects, including the charge distribution map at contact interfaces. This method also provides a convenient way to estimate the carrier density and defect locations, it visualizes a dynamics of valence relocation under thermal fluctuation
format Article
author Hoang, Nam Nhat
author_facet Hoang, Nam Nhat
author_sort Hoang, Nam Nhat
title Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors
title_short Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors
title_full Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors
title_fullStr Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors
title_full_unstemmed Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors
title_sort application of bond-valence modelling method for illustration of point defects in semiconductors
publisher H. : ĐHQGHN
publishDate 2018
url http://repository.vnu.edu.vn/handle/VNU_123/62915
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