Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors
Point defects in semiconductors cause many considerable behaviours of these materials. This article introduces a procedure for modelling of point defects using a structural approach often referred to as a bond-valence method. This method minimalizes the computation cost and facilitates a contruction...
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oai:112.137.131.14:VNU_123-629152018-10-09T08:25:38Z Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors Hoang, Nam Nhat Bond-valence Defects Modelling Tools Point defects in semiconductors cause many considerable behaviours of these materials. This article introduces a procedure for modelling of point defects using a structural approach often referred to as a bond-valence method. This method minimalizes the computation cost and facilitates a contruction of complex 3D images illustrating the point defects, including the charge distribution map at contact interfaces. This method also provides a convenient way to estimate the carrier density and defect locations, it visualizes a dynamics of valence relocation under thermal fluctuation 2018-10-09T08:25:38Z 2018-10-09T08:25:38Z 2018 Article Hoang, N. N. (2018). Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors. VNU Journal of Science: Mathematics – Physics, Vol. 34, No. 3 (2018), 85-89 2588-1124 http://repository.vnu.edu.vn/handle/VNU_123/62915 en VNU Journal of Science; application/pdf H. : ĐHQGHN |
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Bond-valence Defects Modelling Tools |
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Bond-valence Defects Modelling Tools Hoang, Nam Nhat Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors |
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Point defects in semiconductors cause many considerable behaviours of these materials. This article introduces a procedure for modelling of point defects using a structural approach often referred to as a bond-valence method. This method minimalizes the computation cost and facilitates a contruction of complex 3D images illustrating the point defects, including the charge distribution map at contact interfaces. This method also provides a convenient way to estimate the carrier density and defect locations, it visualizes a dynamics of valence relocation under thermal fluctuation |
format |
Article |
author |
Hoang, Nam Nhat |
author_facet |
Hoang, Nam Nhat |
author_sort |
Hoang, Nam Nhat |
title |
Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors |
title_short |
Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors |
title_full |
Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors |
title_fullStr |
Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors |
title_full_unstemmed |
Application of Bond-valence Modelling Method for Illustration of Point Defects in Semiconductors |
title_sort |
application of bond-valence modelling method for illustration of point defects in semiconductors |
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H. : ĐHQGHN |
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2018 |
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http://repository.vnu.edu.vn/handle/VNU_123/62915 |
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1680967552333774848 |