Corrosion studies of ternary Sn-3.0Ag-0.5Cu, Sn-0.7Cu-Ni0.05 and binary Sn-0.8Cu lead-free solder alloys in various liquid media
Solders are critical components in electronic systems. However, environmental issues forced the industry to shift to lead-free systems. Aside from soldering properties, the often overlooked property is the corrosion behavior of new lead-free alloys. The goal of the study is to determine the corrosio...
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| 格式: | text |
| 語言: | English |
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Animo Repository
2016
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| 在線閱讀: | https://animorepository.dlsu.edu.ph/etd_masteral/5196 |
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