Finite element analysis on the factors affecting die crack propagation in BGA under thermo-mechanical loading

• Main Authors: Lim, Niño Rigo Emil G., Ubando, Aristotle T., Gonzaga, Jeremias A., Dimagiba, Richard Raymond N.
• Format: text
• Published: Animo Repository 2020
• Subjects: Ball grid array technology; Semiconductors—Defects; Mechanical Engineering
• Online Access: https://animorepository.dlsu.edu.ph/faculty_research/2111; https://animorepository.dlsu.edu.ph/context/faculty_research/article/3110/type/native/viewcontent
• Institution: De La Salle University

Ball grid array (BGA) is one of the most innovative semiconductor packaging technologies which is capable of high input-output capacities while addressing handling and coplanarity compared with other packages. However, the BGA package is subjected to thermo-mechanical load which makes it susceptible...