Material properties sensitivity analysis based on thermomechanical analysis on warpage for ball grid array semiconductor packaging

• Main Authors: Lim, Niño Rigo Emil G., Arriola, Emmanuel, Moran, Roberto Louis, Mercado, John Patrick, Dimagiba, Richard, Gonzaga, Jeremias, Ubando, Aristotle T.
• Format: text
• Published: Animo Repository 2019
• Subjects: Semiconductors—Defects; Ball grid array technology; Finite element method; Mechanical Engineering
• Online Access: https://animorepository.dlsu.edu.ph/faculty_research/2112; https://animorepository.dlsu.edu.ph/context/faculty_research/article/3111/type/native/viewcontent
• Institution: De La Salle University

With the advancement of technology, semiconductor devices become more complex to satisfy the need for more features while reducing the size. For a component with varying material parts such as the semiconductor package, it is prone to warpage because of the different material properties present in t...