Material properties sensitivity analysis based on thermomechanical analysis on warpage for ball grid array semiconductor packaging
With the advancement of technology, semiconductor devices become more complex to satisfy the need for more features while reducing the size. For a component with varying material parts such as the semiconductor package, it is prone to warpage because of the different material properties present in t...
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| Main Authors: | , , , , , , |
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| Format: | text |
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Animo Repository
2019
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| Subjects: | |
| Online Access: | https://animorepository.dlsu.edu.ph/faculty_research/2112 https://animorepository.dlsu.edu.ph/context/faculty_research/article/3111/type/native/viewcontent |
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| Institution: | De La Salle University |