Design for manufacturability: Package bulging solution path on folded stacked chip packages (FSCSP) high volume manufacturing
This paper will showcase the value of design for manufacturability based on keen understanding of material properties and process interaction. This approach will be shown on the specific example of the bulging phenomenon seen in the substrates and film die attach interfaces of folded stacked chip sc...
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| Main Authors: | , , , |
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| 格式: | text |
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Animo Repository
2006
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| 在線閱讀: | https://animorepository.dlsu.edu.ph/faculty_research/5715 |
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