Design for manufacturability: Package bulging solution path on folded stacked chip packages (FSCSP) high volume manufacturing

• Main Authors: Camacho, Drexel H., Palang, Bernard T., Masicat, Josephibe R., Nuda, Mitzi O.
• Format: text
• Published: Animo Repository 2006
• Subjects: Chip scale packaging; Manufacturing
• Online Access: https://animorepository.dlsu.edu.ph/faculty_research/5715
• Institution: De La Salle University

This paper will showcase the value of design for manufacturability based on keen understanding of material properties and process interaction. This approach will be shown on the specific example of the bulging phenomenon seen in the substrates and film die attach interfaces of folded stacked chip sc...