Philips TEA6845H (QFP 64) solder flakes

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Bibliographic Details
Main Authors:	Fio, Julius, Sia, George, Yutuc, Rico, Cuasay, Mar, Dacones, Jean, Aquino, Delia, Limin, Bobette, Limos, RJ, Carencia, Enrico, Olviga, Jeffrey, Isidro, Reynante, Macarubbo, Roehl M.
Format:	text
Published:	Animo Repository 2004
Subjects:	Solder and soldering Failure analysis (Engineering) Operations Research, Systems Engineering and Industrial Engineering
Online Access:	https://animorepository.dlsu.edu.ph/faculty_research/8335
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Institution:	De La Salle University

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